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The world today is full of electronic devises that help you live an easier life. They come in the form of smart phones, tablets, lap top computers and too many other things to list. The thing most of these items have in common is they all use circuit boards to help maintain continuous service. The reflow soldering oven is one of the machines used to create the circuit boards that are so vital to the communications industry.
By placing a powdered solder mixture on the circuit board manufacturers can bond two materials. The boards are heated in ovens until the solder becomes liquid and will, when cooled, permanently bind the circuits to the board. To complete the process the boards and circuits must travel through four stages of heat and cooling. These stages are called zones by the manufacturers.
The first zone is a preheat period where the boards and other components are heated to determine the ramp up rate. If the boards and circuitry heat up too fast it can cause damage to the components from thermal shock causing cracking and also spattering of solder paste. If the heating process is too low the needed evaporation of the flux in the paste will be incomplete.
The next step in the process is called the thermal soak zone. This is a process that is sixty to one hundred twenty seconds long and serves to remove excess paste from circuit leads and activate the oxide reduction process. Temperature is very important at this stage also to prevent the solder from being damaged or damaging other parts being processed. Thermal assessment of the entire board is done at this point prior to sending it to the next phase of production.
The reflow zone is also called the time above liquidus or TAL. This is the point where the highest temperature is reached. This is a very important component because it must not surpass the highest temperature that can be tolerated by the part most sensitive to thermal damage. The process takes approximately one minute and should be closely monitored to ensure the temperatures do not surpass the limit set for the piece.
Finally the cool down zone where the board gradually cools allowing solder to solidify. Although not as critical as the ramp up process an appropriate cooling process can also help prevent damage to the boards. Specialists recommend a rate of under five degrees per second for cool down.
Having a window to watch the entire process is one of the ways the manufacturer helps the operator. Most of the machines are computerized and can be pre-programmed to do the work without human assistance but being able to see what is happening is important especially on a new run. Many have USB connections so the operators can view them on their computers.
The importance of these ovens is seen every day in nearly every household in the country. People use electronics virtually everywhere they go whether it is to the office or school or driving down the road using a service to find your way. These ovens help provide the convenience of electronics that have become a way of life for many.
By placing a powdered solder mixture on the circuit board manufacturers can bond two materials. The boards are heated in ovens until the solder becomes liquid and will, when cooled, permanently bind the circuits to the board. To complete the process the boards and circuits must travel through four stages of heat and cooling. These stages are called zones by the manufacturers.
The first zone is a preheat period where the boards and other components are heated to determine the ramp up rate. If the boards and circuitry heat up too fast it can cause damage to the components from thermal shock causing cracking and also spattering of solder paste. If the heating process is too low the needed evaporation of the flux in the paste will be incomplete.
The next step in the process is called the thermal soak zone. This is a process that is sixty to one hundred twenty seconds long and serves to remove excess paste from circuit leads and activate the oxide reduction process. Temperature is very important at this stage also to prevent the solder from being damaged or damaging other parts being processed. Thermal assessment of the entire board is done at this point prior to sending it to the next phase of production.
The reflow zone is also called the time above liquidus or TAL. This is the point where the highest temperature is reached. This is a very important component because it must not surpass the highest temperature that can be tolerated by the part most sensitive to thermal damage. The process takes approximately one minute and should be closely monitored to ensure the temperatures do not surpass the limit set for the piece.
Finally the cool down zone where the board gradually cools allowing solder to solidify. Although not as critical as the ramp up process an appropriate cooling process can also help prevent damage to the boards. Specialists recommend a rate of under five degrees per second for cool down.
Having a window to watch the entire process is one of the ways the manufacturer helps the operator. Most of the machines are computerized and can be pre-programmed to do the work without human assistance but being able to see what is happening is important especially on a new run. Many have USB connections so the operators can view them on their computers.
The importance of these ovens is seen every day in nearly every household in the country. People use electronics virtually everywhere they go whether it is to the office or school or driving down the road using a service to find your way. These ovens help provide the convenience of electronics that have become a way of life for many.
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